由工业和信息化部指导,中国半导体行业协会、“核高基”国家科技重大专项总体专家组、北京市科学技术委员会、北京市经济和信息化委员会、中关村科技园区管理委员会、北京市海淀区人民政府、中关村发展集团和首创集团共同主办,北京市半导体行业协会支持,中国半导体行业协会集成电路设计分会、北京中关村集成电路设计园发展有限责任公司、北京集成电路产业发展股权投资基金有限公司、中关村芯园(北京)有限公司、中芯北方集成电路制造(北京)有限公司、上海芯媒会务服务有限公司、上海亚讯商务咨询有限公司共同承办的“中国集成电路设计业2017年会暨北京集成电路产业创新发展高峰论坛”将于2017年11月16日-17日在北京稻香湖景酒店隆重召开。
会议日程
Agenda
2017年11月16日,星期四
Nov 16, Thursday, 2017
地点:北京稻香湖景酒店牡丹厅
Venue: Peony Ballroom, Nirvana Resort Beijing
时 间 Time |
内 容 Contents |
开幕式 Opening Ceremony |
|
08:30-08:50 |
中国半导体行业协会领导致词 Address, CSIA |
北京市及相关部委领导致辞 Address, Beijing and Relative Departments |
|
08:50-09:00 |
签约仪式 Signnature Ceremony |
高峰论坛 Top Forum |
|
09:00-09:30 |
砥砺前行的中国IC设计业 -- 中国半导体行业协会集成电路设计分会理事长 魏少军教授 China Fabless Industry: Keep Moving Forward -- Prof. Shaojun Wei, General Director, CSIA-ICCAD |
09:30-09:45 |
打造国际化集成电路产业发展生态 (拟) -- 中关村发展集团主要领导 Build International IC Industry Development Ecosystem(Draft) -- Major Leader of Zhongguancun Development Group |
09:45-10:00 |
技术+制造 - 打造集成电路产业生态 -- 紫光集团董事长 赵伟国先生 Technology+Foundry-To Build IC Industry Ecosystem -- Mr. Weiguo Zhao, Chairman of Unisgroup |
10:00-10:20 |
引领先进设计方法学,迎接中国半导体黄金十年 -- Synopsys董事会主席兼联席CEO 陈志宽博士 Embracing the GoldenDecade of China Semiconductor with Synopsys Design Methodology Advances -- Dr. Chi-Foon Chan,President and co-CEO, Synopsys
|
10:20-10:40 |
英特尔精尖制造 : 大浪淘沙,永立潮头 -- 英特尔公司全球副总裁兼中国区总裁 杨旭先生 Intel Technology and Manufacturing: Leading at The Edge -- Mr. Ian Yang,Corporate Vice President, President, Intel China |
10:40-11:00 |
从万物互联到万物智联 -- 芯原控股有限公司董事长兼总裁 戴伟民博士 From IoT to AIoT -- Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd. |
11:00-11:20 |
半导体行业的整合化vs.专业化 -- 明导电子中国区总经理 凌琳先生 Semiconductor Consolidation vs. Specialization -- Mr. Pete Ling, China Country Manager, Mentor, A Siemens Business |
11:20-11:40 |
TBD -- 台积电(南京)总经理 罗镇球先生 |
11:40-12:00 |
系统战略推动梦想成真 -- Cadence中国区总经理 徐昀女士 SDE, One Step from Dream to a Reality -- Ms. Sherry Xu, China Country Manager, Cadence |
12:00-13:25 |
自助午餐Buffet Lunch |
13:25-13:30 |
幸运抽奖Lucky Draw |
13:30-13:50 |
半导体展望: 人工智能带来新动能 -- 联华电子副总经理 刘士维先生 Semiconductor Innovation Gears up Artificial Intelligence Revolution -- Mr. Steven Liu, Senior Vice President, UMC |
13:50-14:10 |
拓展工艺及设计服务, 创新产业链合作模式 -- 中芯国际集成电路制造有限公司执行副总裁 汤天申先生 SMIC’s Innovations in Ecosystem Collaboration for Design Services & Technology Offerings -- Mr. Tianshen Tang, EVP, SMIC |
14:10-14:30 |
激发主流物联网半导体技术,打造智能解决方案 -- 格芯物联网及市场副总裁 Rajeev Rajan先生 Unleashing Semiconductor Technologies for Mainstream IoT to Intelligent Solutions -- Mr. Rajeev Rajan, VicePresident, Internet of Things (IoT) and Marketing, GLOBALFOUNDRIES |
14:30-14:50 |
开放创新的生态系统,助力计算新时代 -- Arm中国区战略总监,冯成先生 Open Innovation Ecosystem Enabling New Era of Computing -- Mr. Miles Feng, Director Strategic BD Public Affairs, Arm |
14:50-15:10 |
开放合作,创新融合,EDA助力产业跨界多赢 -- 北京华大九天软件有限公司副总经理 杨晓东先生 Seizing the Opportunity That Open Innovation Offers Us to Achieve Multi-win for Industry by Electronic Design Automation -- Mr. Steve Yang, VP, Huada Empyrean Software Co., Ltd. |
15:10-15:30 |
芯片制造助力全球创新转型 -- 上海华力微电子有限公司市场部部长 杨展悌先生 IC Manufacturing Facilitates Technological Innovation and Upgrading Globally -- Mr. James Yang, Marketing Director, Shanghai Huali Microelectronics Corporation |
15:30-15:45 |
茶歇,交流 Coffee Break |
15:45-15:50 |
幸运抽奖Lucky Draw |
15:50-16:10 |
设计自动化大会(DAC):产学两界芯片设计与设计自动化从业人员的顶级聚会 -- 设计自动化大会执行委员会委员兼Designer Track主席,Cadence电子科技有限公司研发总监 李卓先生 Design Automation Conference: THE Premier Gathering Place for Designers, Design Tool Developers, Researchers, and Managers -- Mr. Zhuo Li, Design Automation Conference Executive Committee Member and Designer Track Chair, Engineering Director, Cadence Design Systems |
16:10-16:30 |
IC新生态下的企业信息安全 -- 北京志翔科技股份有限公司CEO 蒋天仪先生 Information Security in the New Semiconductor Ecosystem -- Mr. Tianyi Jiang, CEO, Zshield Inc. |
16:30-16:50 |
摩尔精英让中国没有难做的芯片 -- 摩尔精英CEO 张竞扬先生 MooreElite - To Make IC Design Business Easy & Fun -- Mr. Jing-Yang JY Zhang, CEO, MooreElite Group |
16:50-17:10 |
14nm和10nm Finfet工艺下如何轻松集成IP -- 芯动科技有限公司CEO 敖海先生 Smooth Integration of Interface IP at 14/10nm -- Mr. Gordon Ao, CEO of INNOSILICON TECHNOLOGY LTD |
17:10-17:30 |
芯片设计在物联网时代的机遇与挑战 -- 成都锐成芯微科技股份有限公司 CEO 向建军先生 New Opportunity and Challenge from IoT -- Mr. Jianjun Xiang, CEO, ChengduAnalog Circuit Technology Inc. |
17:30-17:50 |
终端应用趋势 -- 小米供应链副总裁,江苏紫米电子 技术有限公司创始人、CEO 张峰先 生
Trend of End Application -- Mr. Feng Zhang, VP of Xiaomi Supply Chain, Founder & CEO of ZMI |
17:50-17:55 |
幸运抽奖Lucky Draw |
18:00-19:30 |
曲艺文化鉴赏 Chinese Folk Art Culture Appreciation 地点:北京稻香湖景酒店牡丹厅 Site: Exhibition Hall, Nirvana Resort Beijing |
19:30-21:30 |
欢迎晚宴(Synopsys公司赞助) Welcome Dinner Banquet (Sponsored by Synopsys) 地点:北京稻香湖景酒店牡丹厅 Site: Peony Ballroom, Nirvana Resort Beijing |
2017年11月17日,星期五
Nov 17, Friday, 2017
专题论坛(一)
Subject Forum(Ⅰ)
地点:北京稻香湖景酒店多媒体室
Venue: Multi-function Room, Nirvana Resort Beijing
时 间 Time |
内 容 Contents |
演讲人 Lecturer |
|
IP与IC设计(一) IP and IC Design (I) |
|||
09:00-09:20 |
赛普拉斯公司低 成本高可靠嵌入 式闪存技术 Cypress Embedded Non-Volatile Memory Technologies |
赛普拉斯半导体 大中华区IP授权 事业部总监,那 炜 Wei Na, Director of IPBU, CYPRESS |
|
09:20-09:40 |
C-SKY安全解决 方案为信息安全 提供持续保障 C-SKY Security Solution Provides Sustaining Support for Information Security |
杭州中天微系统 有限公司资深技 术专家&IC设计 部经理,杨军 Stephen Yang, Technical Expert & Manager of IC Design Department, C-SKY Microsystems Co., Ltd. |
|
09:40-10:00 |
蜕变 - 从反向到 正向的跨越式突 破 metamorphosis of IC Design- From RE to Forward Design |
北京芯愿景软件 技术有限公司总 经理,张军 James Zhang, CEO, Cellixsoft Corporation |
|
10:00-10:20 |
第二代高带宽内 存物理层(PHY) 与控制器 (Controller) High Bandwidth Memory (HBM) PHY and Controller |
创意电子股份有 限公司CEO,曾 文正 Vincent Tseng, Director, GLOBAL UNICHIP CORP. Co., Ltd. |
|
10:20-10:40 |
智原ASIC/IP平 台方案 - 助力半 导体产业百家争 鸣新机遇 Faraday’s ASIC/ IP Platform Enables the Innovation of Next Big Wave |
智原科技(上海) 有限公司技术总 监,陈宏铭博士 Dr. Arthur Hung- Ming Chen, Technical & Marketing Director in Faraday Tech. (Shanghai) Corporation |
|
10:40-11:00 |
以Andes CPU IP提升系统芯片 效能 Boosting SoC Performance Efficiency with Andes CPU IP |
晶心科技AVP, 陈志贤 Vincent Chen, AVP, Andes Technology |
|
11:00-11:20 |
IP技术在国内十 年来的演进和发 展 The Evolution and Development of IP Technology in a Decade in China |
四川和芯微电子 股份有限公司董 事长兼CEO,邹 铮贤 Jackie Zou, Chairman of the Board & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd. |
|
11:20-11:40 |
科技新时代的芯 片设计服务 Design Service: Your Trusted Turnkey Partner in Revolution Age |
灿芯半导体(上 海)有限公司首 席技术官,庄志 青 John Zhuang, CTO, Brite Semiconductor (Shanghai) Corporation |
|
11:40-12:00 |
如何设计自驾车 所需高效能SoC 芯片 Building a High Performance SoC for Autonomous Car |
Arteris, Inc.资深 方案架构师,黄 继樟 Brian Huang, Senior Solution Architect, Arteris, Inc. |
|
12:00-12:05 |
幸运抽奖Lucky Draw |
||
12:05-13:30 |
自助午餐Buffet Lunch |
||
EDA与IC设计 EDA and IC Design |
|||
13:30-13:50 |
Cadence Tensilica为人工 智能提供算力支 持 Cadence Tensilica Provide Computing Power for AI |
Cadence公司商 务拓展资深经理 ,徐勇 Jeffrey Xu, Senior Business Development Manager, Cadence China |
|
13:50-14:10 |
从设计到芯片核 签流程中最前沿 的技术 Leading Edge Technologies Are Required For Golden Sign-Off |
明导电子中国区 资深技术经理, 牛风举 Actel Niu, Account Technology Manager, Mentor, A Siemens Business |
|
14:10-14:30 |
Synopsys驱动下 一代芯片设计创 新 Enabling the Next Wave of Design Innovation |
Synopsys中国区 技术应用总监, Kenny Kwan Kenny Kwan, Director, Application Consulting of China, Synopsys |
|
14:30-14:50 |
时序Sign-off的 革命 The Revolution of Timing Sign-off |
北京华大九天软 件有限公司产品 总监,董森华 Senhua Dong, Supervisor of Product, Huada Empyrean Software Co., Ltd. |
|
14:50-15:10 |
茶歇,交流Coffee Break |
||
15:10-15:30 |
集成电路硬件安 全:保证信息系 统安全可靠的物 理基础 Hardware Security: The Physical Protection of Modern IT System |
中国科学院EDA 中心主任,陈岚 博士 Dr. Lan Chen, Director, EDA Center of Chinese Academy of Sciences |
|
15:30-15:50 |
新一代功耗、噪声、可靠性分析平台 – RedHawk-SC Next Generation SoC Power Noise Reliability Sign off by RedHawk-SC |
ANSYS公司主任工程师,赵常 Chang Zhao, Lead Application Engineer, ANSYS |
|
15:50-16:10 |
倍增你的仿真容量 Double Your Simulation Capacity |
北京天云融创软件技术有限公司副总裁,郭宏 Hong Guo, VP, Skycloud Software Co., Ltd. |
|
16:10-16:30 |
先进工艺节点的寄生RC分析和缩减 Analaysis and Reduction of Parasitic RCs For Advanced Nodes |
芯师(上海)电子科技有限公司AE Manager,刘客 Ke Liu, AE Manager, Silvaco China., Ltd. |
|
16:30-16:50 |
下一代ECO平台带来性能、功耗与面积的优化,以及可靠性的提高 The Next Generation ECO Platform for Optimizing Performance, Power, Area and Improving Reliability |
知亿科技技术咨询总监,林仕洲 Joe Lin, Technical Consulting Director, Dorado Design Automation, Inc. |
|
16:50-17:10 |
台积电12FFC设计平台与生态系统 TSMC N12FFC Design Platform and Ecosystem |
台积电中国业务发展技术经理,卓铭 Ming Zhuo, Technical Manager, Business Development, TSMC |
|
17:10-17:30 |
ECO手术: 逆向工程导引可能零补丁的第三代ECO技术 Easy DSP-ECO: A 3rd gen ECO Evolved from Adding Patches to Reverse Engineering Guided “ECO Operations” that might need No Patch |
香港奇捷科技股份有限公司CEO,吴有亮 Yu-Liang Wu, CEO, Hong Kong Easy-Logic Technology Ltd. |
|
17:30-17:35 |
幸运抽奖Lucky Draw |
||
18:00-20:00 |
闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony 地点:北京稻香湖景酒店东方苑 Site: Dongfangyuan, Nirvana Resort Beijing |
2017年11月17日,星期五
Nov 17, Friday,2017
专题论坛(二)
Subject Forum(Ⅱ)
地点:北京稻香湖景酒店牡丹1厅
Venue: Peony Ballroom 1, NirvanaResort Beijing
时 间
Time
内 容
Contents
演讲人
Lecturer
FOUNDRY与工艺技术
Foundry and Manufacturing Process Technology
09:00-09:20
台积电的领先技
术:7奈米/12奈米/22奈米
TSMC Technology
Leadership: N7/
N12/N22
台积电中国业务发展技术经理,何瑞灵
Ray He,
Technical
Manager,
Business
Development,
TSMC
09:20-09:40
格芯智能制造/工业4.0
GlobalFoundries
Smart
Manufacturing/
Industry 4.0
格芯全球副总裁兼大中华区总经理,白农
Wallace Pai,
Vice President
and General
Manager of
Greater China,
GLOBALFOUN-DRIES
09:40-10:00
迎接即将爆发的新产品应用浪潮 - 晶圆专工在特殊工艺的技术创新
Foundry
Innovation on
Specialty
Technology for
Emerging
Applications
联华电子协理,丁文琪
Wenchi Ting,
Associate Vice
President, UMC
10:00-10:20
垂直生态系统及跨行业合作
Vertical Channel
Eco-System &
Cross-Industry
Cooperation
中芯国际集成电路制造有限公司垂直市场生态策略总监,吴耿源
KY Wu, Director of Vertical
Channel
Marketing,SMIC
10:20-10:40
华力微电子28纳米低功耗工艺技术
HLMC 28LP
PolySiON
Technology
上海华力微电子有限公司研发二部总监,彭树根
Albert Pang,
Senior Director
of TD, Shanghai
Huali
Microelectronics
Co., Ltd.
10:40-11:00
摩尔精英让中国没有难做的芯片
MooreElite - To
MakeIC Design
Business Easy
& Fun
摩尔精英COO,董伟
Wei Leo Dong,
COO,
MooreElite
Group
11:00-11:20
深耕模拟与功率半导体制造,助力集成电路成长
CSMC,
Specialized in
Analog and Power
Management
Foundry and
Boosted
Customer's
Growth
华润上华科技有限公司市场销售副总,邵军
Jun Shao, VP of Marketing and
Sales, CSMC
11:20-11:40
三重富士通车规级芯片制造开发与质量管理
Mie Fujitsu
Semiconductor
Automotive IC
Manufacturing
and Quality
Management
三重富士通半导体股份有限公司市场部部长,罗良辅
Liangfu Lo,
Director (Aisa &
Korea) of
Marketing
Dept.,
MIE Fujitsu
Semiconductor
Limited
11:40-12:00
智能时代,畅想
“芯”机遇
Opportunities in
the Smart Era
上海华虹宏力半导体制造有限公司战略、市场与发展部门部长,胡湘俊
Calvin Hu,
Director of
Strategy,
Marketing and
Development
Division,
Shanghai
Huahong Grace
Semiconductor
Manufacturing
Corporation
12:00-12:05
幸运抽奖Lucky Draw
12:05-13:30
自助午餐 Buffet Lunch
13:30-13:50
特种工艺链接世界
A World
Connected by
Specialty
Technologies
TowerJazz中国区总经理,秦磊
Lei Qin, Senior
Sales Director
China Country
Manager,
TowerJazz
13:50-14:10
流片服务对于芯片研发和产品成功的重要性
Professional
Tapeout Service
Plays a Key Role
in R&D and
Market Success
MOSIS专业流片服务机构业务拓展经理,袁泉
Quan Yuan,
Business
Development
Manager, The
MOSIS Service
14:10-14:30
AMS尖端模拟工艺平台,助力客户进入高毛利市场
AMS High
Performance
Analog Process
Support Customer
Enter High Profit
Market
上海劢仕电子有限公司市场部经理,周之琦
Zhiqi Zhou,
Marketing
Manager,
Shanghai MEDs
Technology
Co., Ltd.
14:30-14:50
武汉新芯特种工艺平台
XMC Specialty
Process Platform
武汉新芯集成电路制造有限公司芯片代工事业部总监,沈亮
Neo Shen,
Director of
Foundry
Service
Business Unit,
XMC
14:50-15:10
茶歇,交流Coffee Break
资本与IC设计业
Capital and IC Design Industry
15:10-15:30
新时代下,中国IC行业发展展望
China IC Industry
Development
Prospects in
New Era
华芯投资管理有限责任公司副总裁,高松涛
Songtao Gao,
Vice President,
SINO IC
CAPITAL Co.,
Ltd.
15:30-15:50
从投资的角度看中国IC设计业的现状与发展
China IC Design
Industry Situation
and Development
from the Point of
Investment
中芯聚源股权投资管理有限公司总裁,孙玉望
Yuwang Sun,
President,
China
Fortune-Tech
Capital Co., Ltd.
15:50-16:10
风口浪尖上的中国半导体
China IC in Big
Waves
华登国际董事总经理,黄庆博士
Dr. Hing Wong,
Managing
Director(MD),
Walden
International
自由研讨 — IPO、企业并购和商业经营,
产业发展缺一不可的路径
Panel – IPO, M & A and Business Operation,
Integral Industry Development Way
16:10-17:30
研讨嘉宾:魏少军、陈大同、黄庆、高松涛、孙玉望等
在举国半导体投资发展热潮中,中国集成电路设计行业也有了长足的发展,继紫光集团成功收购展讯锐迪科之后;清芯华创牵头收购豪威科技,武岳峰牵头收购ISSI,兆易创新成功IPO成为全体中国IC设计公司瞩目的最新焦点!
那么,下一个兆易创新会在哪里?近距离面对中国这个最让人魂系神往的资本市场,我们中国集成电路设计企业应该如何才能淡定应对?全球集成电路行业会在那个层面展开新一轮的创新竞争?
Honored Guests:Prof. Wei
Shaojun, Dr. Chen Datong, Dr.
Hing Wong, Mr. Gao Songtao,
etc.
Under the Tide of National
Semiconductor Investment and
Development, China IC Design
Industry has been Developing
Rapidly. After UnisGroup
successfully Acquired
Spreadtrum and RDA, Hua
Capital led to Acquire
OmniVision, Summit View
Capital led to Acquire ISSI,
China IC Design Industry is all
Focusing on Giga Device
successful IPO!
Then, Where is Next Giga Device?
When closely Facingthis China
Charming Capital Market, How
shall We China IC Design Industry
Respond Calmly? What’s Next
Innovation Competition for Global
IC Industry?
17:30-17:35
幸运抽奖Lucky Draw
18:00-20:00
Closing Banquet and Flag
Handover Ceremony
地点:北京稻香湖景酒店东方苑
Site: Dongfangyuan, Nirvana
Resort Beijing
闭幕晚宴及交旗仪式
2017年11月17日,星期五
Nov 17, Friday,2017
专题论坛(三)
Subject Forum(Ⅲ)
地点:北京稻香湖景酒店牡丹2厅
Venue: Peony Ballroom 2, NirvanaResort Beijing
时 间
Time
内 容
Contents
演讲人
Lecturer
IP与IC设计(II)
IP and IC Design (II)
09:00-09:20
钢铁是怎样炼成的
The Road to
KX-5000 Series
上海兆芯集成电路有限公司副总裁,傅城
ChengFu, VP,
Shanghai
Zhaoxin
Semiconductor
Co., Ltd.
09:20-09:40
台积电7nm先进工艺下的设计方法
TSMC N7 Digital Design
Enablement
台积电南京设计服务中心部门经理,曹宗良
Z.L. CAO,
Department
Manager,
Nanjing Design
Service Center,
TSMC
09:40-10:00
高效的处理架构让AI无处不在
An Efficient
Processor
Architecture
Enable AI
Everywhere
芯原控股有限公司执行副总裁、
IP事业部总经理、首席战略官,戴伟进
Weijin Dai,
Executive Vice
President, GM
of IP Division
and Chief
Strategy Officer,
VeriSilicon
Holdings Co.,
Ltd.
10:00-10:20
面向物联网设备的平台安全架构
Platform Security Architecture for
IoT Device
Arm高级技术市场经理,王骏超
Eric Wang,
Senior
Technical
Marketing
Manager,
Arm China
10:20-10:40
高度定制化IP解决方案的现状和展望
The Trend and
Prospect of
Highly Customized
IP Solution
芯动科技有限公司FAE总监,何颖
Huck He, FAE
Director,
Innosilicon
Technology Ltd.
10:40-11:00
汽车MCU软件、硬件平台型开发技术
Discussion of Auto
MCU Softwareand
Hardware Platform
Development
Technology
恩智浦半导体汽车控制器和处理器事业部亚太市场总监,易生海
Jerwern Yi,
Marketing
Director,
Asia Auto
MCU and
MPU, NXP
11:00-11:20
人工智能时代的2.5D/3D先进封装设计
2.5D/3D Advanced
Packaging Design
for Artificial
Intelligence Era
苏州芯禾电子科技有限公司创始人/工程副总裁,代文亮
Dai Wenliang,
Founder VP
Engineering,
Xpeedic
Technology
11:20-11:40
浅谈人工智能时代的高性能计算芯片
Brief Discussion of
High Performance
Computing Chip
in AI Era
无锡华大国奇科技有限公司
CEO,谷建餘
Jianyu Gu,
CEO, Qualchip
Technologies,
Inc.
11:40-12:00
现今趋势中在线存储器测试与修复之应用
The Trend of
Memory on
Demand Test and
Repair of
Applications
厚翼科技中国区销售总监,王炳兴
Benson Wang, VP of China
Region, HOYTechnologies Corp.
12:00-12:05
幸运抽奖Lucky Draw
12:05-13:30
自助午餐 Buffet Lunch
13:30-13:50
The Challenge of Systemic
Complexity: The
Need for An
Architecture for
Debug, Safety &
Security
Rupert Baines, CEO, UltraSoC
13:50-14:10
M31低功耗套装平台
M31 Low Power
Platform
円星科技股份有限公司业务副总监,林世腾
Johnson Lin,
Deputy Sales
Director, M31
Technology
14:10-14:30
针对NB-IoT终端设备的单处理器核完整IP方案
Complete Single
Processor IP
Solution for NB-
IoT Enabled
Endpoint Devices
CEVA中国FAE经理,杨晔
Luke Yang,
China FAE
Manager, CEVA
14:30-14:50
领导变革-芯片行业如何部署技术创新和外包战略
Leading the
Disruptions
- How does
Industrials &
Electronics
Industry Deploy
Technology
Innovation and
Outsourcing
Strategy
亚创中国半导体事业部总监,石贤帅
Xianshuai
(Stone) Shi,
I&E Division
Director,
Altran China
14:50-15:10
茶歇,交流Coffee Break
15:10-15:30
Chips&Media面向监控/车载应用,针对低照度环境优化的ISPIP
Low Light
Environment
Optimized Image
Signal Processing
IP for Surveillance
and Automotive
Applications
Chips&Media中国区销售经理,陶南
Larry Tao,
Country
Manager
China Sales,
Chips&Media
15:30-15:50
Imagination AI解决方案激发智能社会充满想象
Imagination AI
Stimulate the
Innovation of
Human Society
Imagination中国区市场总监,柯川
Bowen Ke,
Marketing
Director,
Imagination
Technologies
15:50-16:10
系统层级设计方法: 架构探索与高阶合成设计
Electronic System
- Level Design
Methodology:
Architecture
Exploration & High
Level Synthesis
宏太科技股份有限公司应用经理,王义成
Frank Wang, AE
Manager, Avant
Technology Inc.
16:10-16:30
针对自动驾驶SoC的智能互联
Intelligent
Interconnect for
Automotive SoCs
Alex Chao,
Sr. Director of
Worldwide Field
Applications,
NetSpeed
Systems
16:30-16:50
物联网应用之安全强化- 特殊型
NeoFuse IP解决方案
Specialty NeoFuse
IP Simplify
Security
Enhancement for
IoT Application
力旺电子营销副处长,郭东政
Steve Kuo,
Marketing
Deputy
Director,
eMemory
16:50-17:10
多用途的嵌入式
SuperFlash技术
在物联网和汽车电
子上的应用
Versatile
Embedded
SuperFlash®
Technology for
IoT and
Automotive
Applications
Vipin Tiwari,
Director,
Marketing and
Business
Development,
Silicon Storage
Technology, Inc.
17:10-17:30
物联网时代的
DRAM:高速,串
接简易
DRAM for IoT
Applications with
Low-Pin Count,
High Speed, Serial
Interface
爱普科技股份有限公司总经理,顾峻
Jun Gu, GM, AP Memory
Technology
CO., LTD.
17:30-17:35
幸运抽奖Lucky Draw
18:00-20:00
闭幕晚宴及交旗仪式
Closing Banquet and Flag
Handover Ceremony
地点:北京稻香湖景酒店东方苑
Site: Dongfangyuan, Nirvana
Resort Beijing
Chips&Media’s
2017年11月17日,星期五
Nov 17, Friday,2017
专题论坛(四)
Subject Forum(Ⅳ)
地点:北京稻香湖景酒店牡丹3厅
Venue: Peony Ballroom 3, NirvanaResort Beijing
时 间
Time
内 容
Contents
演讲人
Lecturer
封装测试与IC设计
IC Design and Packaging & Testing
09:00-09:20
高速成长IC新应用的先进封装技术
Advance
Packaging
Technologies for
the Fast Growing
IC Applications
江苏长电科技股份有限公司高级副总裁,梁新夫
Steve Xin Liang,
SVP, JCET
09:20-09:40
通富微电在
Processing Unit的
封测解决方案
TFME Full
Backend Solution
at Processing Unit
通富微电子技术中心副总,林伟
Wayne Lin, Vice
President, R&D
Center, TFME
09:40-10:00
芯片产品的全程可溯
IC Product
Traceability
Across Supply
Chain
PDF中国总经理、全球副总裁,房华博士
Dr. Hua Fang,
PDF-China GM,
Global VP
10:00-10:20
智能芯片商机与可靠性之挑战
Business
Opportunity and
Challenge for AI
Semiconductors
宜特检测技术有限公司董事长,崔革文
Kevin Tsui, iST
China Chairman
& General
Manager
10:20-10:40
车用电子新一波的封装技术趋势与解决方案
New Wave
Technology Trend
& Packaging
Solution for
Automotive
Application
日月光集团制造工程处处长,沈政昌
Allen Shen,
Engineering
Director,
ASE Group
10:40-11:00
系统级封装(SiP)的市场和技术发展趋势
SiP (System in
Package) Market
and Technology
Trend
安靠封装测试资深总监,李吕祝
John Lee, Sr.
Director, Amkor
Technology
11:00-11:20
高性能计算应用之创新封装解决方案
The Innovate
Packaging
Solutions In High
Performance
Computing
矽品精密工业股份有限公司研发中心客户前瞻产品处副处长,陈盟顺
Royal Chen,
Deputy Director,
Customer
Advanced
Package
Application
Engineering of
CRD, SPIL
11:20-11:40
IC设计与Probe
Card结合的重要性
IC Design and
Probe Card
Integration
Solutions
深圳市道格特科技有限公司副总经理,李忠民
Tommy Lee, VP,
Shenzhen
Doctor
Technology
Co., Ltd.
11:40-12:00
物联网技术的测试挑战以及是德科技的解决方案
IoT Technology
Test Challenges
and Keysight
Solutions
是德科技中华区市场部行业市场经理,祝晓悦
Xiaoyue Zhu,
Marketing
Industry
Manager,
Keysight
Technologies
12:00-12:05
幸运抽奖Lucky Draw
12:05-13:30
自助午餐Buffet Lunch
13:30-13:50
持续驱动集成电路小型化和性能提升的晶圆级封装技术
Wafer-level
Packaging
Technologies as
A Key Enabler for
Continuous
Miniaturization
and Performance
Enhancement of
Integrated Circuits
华天科技(昆山)电子有限公司技术总监,王腾
Teng Wang,
Technical
Director,
Huatian
Technology
(Kunshan)
Electronics
Co., Ltd.
13:50-14:10
TestTrends: Past,
Present and
Predicting the
Future
泰瑞达半导体测试部SoC商务组和市场销售副总裁兼总经理,徐建仁
Jason Zee,
VP and GM,
SoC Business
Group and
Marketing,
Teradyne
14:10-14:30
R&S 最新IoT测试技术和解决方案
R&S Latest IoT
Test Techniques
and Solutions
罗德与施瓦茨(中国)科技有限公司业务发展主管,杨洪文
Hongwen Yang,Business
Development
Manager,
Rohde &
Schwarz
(China)
Technology
Co., Ltd.
14:30-14:50
利用NI平台降低测试成本与加速产品上市时间
Lowering the Cost
of Test while
Improving Time-
To-Market with NI
Platform-based
Approach
美国国家仪器有限公司市场工程师,马力斯
Lisi Ma,
Technical
Marketing
Engineer,
National
Instruments
14:50-15:10
茶歇,交流Coffee Break
15:10-15:30
物联网时代的芯片测试解决方案
Testing Devices
for the IoT and
Smart
Applications
爱德万测试(中国)管理有限公司北京分公司测试技术部课长,张可
Ke Zhang,
Section
Manager, BJT
Department,
Advantest
(China)
Co., Ltd.
Beijing Branch
15:30-15:50
全方位测试解决方案
Comprehensive
Semiconductor
Testing Solution
京元电子股份有限公司资深处长,刘大纲
Takang Liu,
Senior Director,
KYEC Yuan
Electronics
Co., Ltd.
15:50-15:55
幸运抽奖Lucky Draw
闭幕晚宴及交旗仪式
Closing Banquet and Flag
Handover Ceremony
地点:北京稻香湖景酒店东方苑
Site: Dongfangyuan, Nirvana
Resort Beijing
测试的发展趋势:过去,现状及预测未来
18:00-20:00
2017年11月17日,星期五
Nov 17, Friday, 2017
专题论坛(五)
Subject Forum (V)
地点:北京稻香湖景酒店牡丹4厅
Venue: Peony Ballroom 4, Nirvana Resort Beijing
时 间 Time |
内 容 Contents |
演讲人 Lecturer |
|
“芯”动北京 - 暨首届中关村IC产业发展论坛 Chip-Power Beijing and First Zhongguancun IC Industry Development Forum |
|||
主持人:中关村集成电路设计园领导主持 Moderator: IC PARK Leader |
|||
09:00-09:05 |
海淀区领导致欢迎词 Welcome Speech from the Leader of Haidian District Government |
||
09:05-09:10 |
中关村管委会领导讲话 Speech from the Leader of Administrative Committee of Zhongguancun Science Park |
||
09:10-09:15 |
市科委领导讲话 Speech from the Leader of Beijing Municipal Committee of Science and Technology |
||
09:15-09:30 |
人工智能行业研究及成果转化 Research and Result Transformation of AI Industry |
清华微电子所所长,魏少军教授 Prof. Shaojun Wei, Director, Institute of Microelectronics, Tsinghua University |
|
09:30-09:45 |
百度人工智能的基础技术及应用创新 Basic Technology and Application Innovation of Baidu AI |
百度技术体系主任架构师,欧阳剑 Jian Ouyang, Director, Technology System Architect, Baidu |
|
09:45-10:00 |
人工智能时代的端到端芯片战略 End-to-end Chip Strategy in the AI Era |
英特尔中国研究院院长,宋继强 Jiqiang Song, General Manager, Intel Labs China |
|
10:00-10:15 |
嵌入式人工智能:从算法到处理器 Embedded AI: From Algorithms to Processors |
北京地平线机器人技术研发有限公司创始人&CEO,余凯 Kai Yu, Founder & CEO, Beijing Horizon Robotics Technology Research and Development Co., Ltd. |
|
10:15-10:30 |
智能语音技术如何商业化应用 How to Commercialize Intelligent Voice Technologies |
北京云知声信息 技术有限公司 CEO,黄伟 Wei Huang, CEO, Unisound |
|
10:30-10:45 |
智慧存储加速人工智能创新 Intelligent Storage for Artificial Intelligence |
英韧创信息科技 有限公司董事长 兼CEO,吴子宁 Zining Wu, Chairman and CEO, InnoGrit Co., Ltd. |
|
10:45-11:00 |
存储的共享与自治——万物智联时代的数据管理 Perception, Comprehension and Memory -- New Storage Requirement in the AI Era |
北京忆芯科技有限公司ASIC设计首席工程师,孙唐 Tang Sun, Chief Architect, ASIC Design, Starblaze Technology Co., Ltd. |
|
11:00-11:05 |
幸运抽奖Lucky Draw |
||
12:00-13:30 |
自助午餐Buffet Lunch |
||
芯片奥林匹克IEEE国际固态电路峰会 ISSCC中国发布会 - 最新IC设计技术趋势 “Chip Olympic” - IEEE ISSCC China Press Conference – Technical Trends of IC Design |
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主持人:ISSCC国际技术委员会中国区代表, 余成斌教授,IEEE会士 Moderator: Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative |
|||
13:30-13:50 |
注册 Registration |
||
13:50-14:00 |
致欢迎词 -- Jan van der Spiegel 教授和IEEE会 士,IEEE ISSCC 2018执行委员会成 员,IEEE SSCS现任主席,美国宾夕 法尼亚大学(清华大学访问教授) Welcome Remarks -- Prof. Jan van der Spiegel, IEEE Fellow, IEEE ISSCC 2018 Executive Committee Member, IEEE SSCS President, Univ. of Pennsylvania, USA |
||
14:00-14:10 |
芯片奥林匹克IEEE国际固态电路峰会 ISSCC 2018简介 -- Sungdae Choi博士,ISSCC国际技术委员会远东区主席,韩国海力士半导体 Introduction of Chip Olympic IEEE ISSCC 2018 -- Dr. Sungdae Choi, ISSCC 2018 ITPC Far East Chair, SK Hynix, Korea |
||
14:10-14:20 |
ISSCC 2018远东区的技术趋势 -- 李泰成教授,ISSCC国际技术委员会远东区副主席, 台湾大学 Far East Technical Trends for ISSCC 2018 -- Tai-Cheng Lee, ISSCC ITPC Far East Vice-Chair, Taiwan University |
||
14:20-14:35 |
ISSCC 2018中国区入选论文和发展趋势 -- 余成斌教授和IEEE会士,ISSCC国际技术委员会委员及中国区代表,澳门大学和新诺普思澳门 -- 王志华教授和IEEE会士,SSCS行政委员会委员,清华大学 ISSCC 2018 China Papers and Trends -- Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative, Univ. of Macau and Synopsys Macau -- Prof. Zhihua Wang, IEEE Fellow, SSCS AdCom, Tsinghua University |
||
14:35-14:50 |
问答讨论(首轮)和合影 Q&A (1st round) and Group Photo |
||
14:50-15:10 |
茶歇,交流Coffee Break |
||
ISSCC 2018峰会设计领域论文亮点和点评 ISSCC 2018国际技术委员会委员 ISSCC 2018 Subcommittee Paper Highlights ISSCC 2018 International Technical Program Committee (ITPC) Member |
|||
15:10-15:20 |
电源管理 Power Management |
复旦大学,洪志良教授 Prof. Zhiliang Hong, Fudan University |
|
15:20-15:30 |
模拟电路 / 射频电路 Analog / RF |
澳门大学,罗文基副教授 Prof. Man-Kay Law, Univ. of Macau |
|
15:30-15:40 |
数据转换器 Data Converters |
澳门大学和新诺普思澳门,余成斌教授 (Ben) U, Univ. of Macau and Synopsys Macau |
|
15:40-15:50 |
数字架构和系统 / 数字电路 Digital Architecture & System / Digital Circuits |
日本东京大学, Makoto Takamiya教授 Prof. Makoto Takamiya, Univ. of Tokyo |
|
15:50-16:00 |
存储器 Memory |
韩国海力士半导体,Sungdae Choi博士 Dr. Sungdae Choi, SK Hynix |
|
16:00-16:10 |
图像, MEMS, 医疗和显示 / 有线通讯 MEMS, Medical & Displays (IMMD) / Wireline |
台湾大学,李泰成教授 Prof. Tai-Cheng Lee, Taiwan University |
|
16:10-16:20 |
无线通讯 / 前瞻技术领域 Wireless / Technology Directions |
澳门大学,麦沛然教授 Prof. Pui-In Mak, University of Macau |
|
16:20-16:40 |
问答讨论(第二轮) Q&A (2nd round) |
||
16:40-16:45 |
幸运抽奖Lucky Draw |
||
18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:北京稻香湖景酒店东方苑 Site: Dongfangyuan, Nirvana Resort Beijing |
会议日程以最终现场公布为准。
Agendaup to final site release.