由工业和信息化部指导,中国半导体行业协会、“核高基”国家科技重大专项总体专家组、北京市科学技术委员会、北京市经济和信息化委员会、中关村科技园区管理委员会、北京市海淀区人民政府、中关村发展集团和首创集团共同主办,北京市半导体行业协会支持,中国半导体行业协会集成电路设计分会、北京中关村集成电路设计园发展有限责任公司、北京集成电路产业发展股权投资基金有限公司、中关村芯园(北京)有限公司、中芯北方集成电路制造(北京)有限公司、上海芯媒会务服务有限公司、上海亚讯商务咨询有限公司共同承办的“中国集成电路设计业2017年会暨北京集成电路产业创新发展高峰论坛”将于2017年11月16日-17日在北京稻香湖景酒店隆重召开。

会议日程

Agenda

20171116日,星期四

Nov 16, Thursday, 2017

 

地点北京稻香湖景酒店牡丹厅

Venue: Peony Ballroom, Nirvana Resort Beijing

时  间

Time

内        容

Contents

开幕式

Opening Ceremony

08:30-08:50

中国半导体行业协会领导致词

Address, CSIA

北京市及相关部委领导致辞

Address, Beijing and Relative

Departments

08:50-09:00

签约仪式

Signnature Ceremony

高峰论坛

Top Forum

09:00-09:30

砥砺前行的中国IC设计业

-- 中国半导体行业协会集成电路设计分会理事长  魏少军教授

China Fabless Industry: Keep

Moving Forward

-- Prof. Shaojun Wei, General

Director, CSIA-ICCAD

09:30-09:45

打造国际化集成电路产业发展生态

(拟)

-- 中关村发展集团主要领导

Build International IC Industry

Development EcosystemDraft

-- Major Leader of Zhongguancun

Development Group

09:45-10:00

技术+制造 - 打造集成电路产业生态

-- 紫光集团董事长 赵伟国先生

Technology+Foundry-To Build

IC Industry Ecosystem

-- Mr. Weiguo Zhao, Chairman of

Unisgroup

10:00-10:20

引领先进设计方法学,迎接中国半导体黄金十年

-- Synopsys董事会主席兼联席CEO 陈志宽博士

Embracing the GoldenDecade of China Semiconductor with Synopsys Design Methodology Advances

-- Dr. Chi-Foon Chan,President and co-CEO, Synopsys

10:20-10:40

英特尔精尖制造 : 大浪淘沙,永立潮头

-- 英特尔公司全球副总裁兼中国区总裁  杨旭先生

Intel Technology and Manufacturing:

Leading at The Edge

-- Mr. Ian Yang,Corporate Vice

President, President, Intel China

10:40-11:00

从万物互联到万物智联

-- 芯原控股有限公司董事长兼总裁  戴伟民博士

From IoT to AIoT

-- Dr. Wayne Dai, Chairman,

President and CEO, VeriSilicon

Holdings  Co., Ltd.

11:00-11:20

半导体行业的整合化vs.专业化

-- 明导电子中国区总经理  凌琳先生

Semiconductor Consolidation vs.

Specialization

-- Mr. Pete Ling, China Country

Manager, Mentor, A Siemens

Business

11:20-11:40

TBD

-- 台积电(南京)总经理  罗镇球先生

11:40-12:00

系统战略推动梦想成真

-- Cadence中国区总经理  徐昀女士

SDE, One Step from Dream to a

Reality

-- Ms. Sherry Xu, China Country

Manager, Cadence

12:00-13:25

自助午餐Buffet Lunch

13:25-13:30

幸运抽奖Lucky  Draw

13:30-13:50

半导体展望人工智能带来新动能

-- 联华电子副总经理  刘士维先生

Semiconductor Innovation Gears up Artificial Intelligence Revolution

-- Mr. Steven Liu, Senior Vice

President, UMC


13:50-14:10

拓展工艺及设计服务创新产业链合作模式

-- 中芯国际集成电路制造有限公司执行副总裁  汤天申先生

SMIC’s Innovations in Ecosystem

Collaboration for Design Services &

Technology Offerings

-- Mr. Tianshen Tang, EVP, SMIC

14:10-14:30

激发主流物联网半导体技术,打造智能解决方案

-- 格芯物联网及市场副总裁 Rajeev

Rajan先生

Unleashing Semiconductor

Technologies for Mainstream IoT to

Intelligent Solutions

-- Mr. Rajeev Rajan, VicePresident,

Internet of Things (IoT) and

Marketing, GLOBALFOUNDRIES

14:30-14:50

开放创新的生态系统,助力计算新时代

-- Arm中国区战略总监,冯成先生

Open Innovation Ecosystem

Enabling New Era of Computing

-- Mr. Miles Feng, Director Strategic BD Public Affairs, Arm

14:50-15:10

开放合作,创新融合,EDA助力产业跨界多赢

-- 北京华大九天软件有限公司副总经理  杨晓东先生

Seizing the Opportunity That Open

Innovation Offers Us to Achieve

Multi-win for Industry by Electronic

Design Automation

-- Mr. Steve Yang, VP, Huada

Empyrean Software Co., Ltd.

15:10-15:30

芯片制造助力全球创新转型

-- 上海华力微电子有限公司市场部部长  杨展悌先生

IC Manufacturing Facilitates

Technological Innovation and

Upgrading Globally

-- Mr. James Yang, Marketing

Director, Shanghai Huali

Microelectronics Corporation

15:30-15:45

茶歇,交流 Coffee Break

15:45-15:50

幸运抽奖Lucky Draw

15:50-16:10

设计自动化大会(DAC):产学两界芯片设计与设计自动化从业人员的顶级聚会

-- 设计自动化大会执行委员会委员兼Designer Track主席,Cadence电子科技有限公司研发总监  李卓先生

Design Automation Conference:

THE Premier Gathering Place for

Designers, Design Tool Developers,

Researchers, and Managers

-- Mr. Zhuo Li, Design Automation

Conference Executive Committee

Member and Designer Track Chair,

Engineering Director, Cadence

Design Systems

16:10-16:30

IC新生态下的企业信息安全

-- 北京志翔科技股份有限公司CEO  蒋天仪先生

Information Security in the New

Semiconductor Ecosystem

-- Mr. Tianyi Jiang, CEO, Zshield

Inc.

16:30-16:50

摩尔精英让中国没有难做的芯片

-- 摩尔精英CEO  张竞扬先生

MooreElite - To Make IC Design

Business Easy & Fun

-- Mr. Jing-Yang JY Zhang, CEO,

MooreElite Group

16:50-17:10

14nm和10nm Finfet工艺下如何轻松集成IP

-- 芯动科技有限公司CEO  敖海先生

Smooth Integration of Interface IP at 14/10nm

-- Mr. Gordon Ao, CEO of

INNOSILICON TECHNOLOGY LTD

17:10-17:30

芯片设计在物联网时代的机遇与挑战

-- 成都锐成芯微科技股份有限公司

CEO  向建军先生

New Opportunity and Challenge

from IoT

-- Mr. Jianjun Xiang, CEO, ChengduAnalog Circuit Technology Inc.

17:30-17:50

终端应用趋势

-- 小米供应链副总裁,江苏紫米电子

技术有限公司创始人、CEO  张峰先

Trend of End Application

-- Mr. Feng Zhang, VP of Xiaomi

Supply Chain, Founder & CEO of

ZMI

17:50-17:55

幸运抽奖Lucky Draw

18:00-19:30

曲艺文化鉴赏

Chinese Folk Art Culture

Appreciation

地点:北京稻香湖景酒店牡丹厅

Site: Exhibition Hall, Nirvana Resort Beijing

19:30-21:30

欢迎晚宴(Synopsys司赞助)

Welcome Dinner Banquet

(Sponsored  by Synopsys)

地点:北京稻香湖景酒店牡丹厅

Site: Peony Ballroom, Nirvana

Resort Beijing


20171117日,星期五

Nov 17, Friday, 2017

专题论坛(一)

Subject Forum(Ⅰ)

 

地点:北京稻香湖景酒店多媒体室

Venue: Multi-function Room, Nirvana Resort Beijing


  间

Time

内  容

Contents

演讲人

Lecturer

IPIC设计(一)

IP and IC Design (I)

09:00-09:20

赛普拉斯公司低

成本高可靠嵌入

式闪存技术

Cypress

Embedded

Non-Volatile

Memory

Technologies

赛普拉斯半导体

大中华区IP授权

事业部总监,那

Wei Na, Director

of IPBU, 

CYPRESS

09:20-09:40

C-SKY安全解决

方案为信息安全

提供持续保障

C-SKY Security

Solution

Provides

Sustaining

Support for

Information

Security

杭州中天微系统

有限公司资深技

术专家&IC设计

部经理,杨军

Stephen Yang,

Technical Expert

& Manager of IC

Design

Department,

C-SKY

Microsystems

Co., Ltd.

09:40-10:00

 - 从反向到

正向的跨越式突

metamorphosis

of IC Design-

From RE to

Forward Design



北京芯愿景软件

技术有限公司总

经理,张军

James Zhang,

CEO, Cellixsoft

Corporation

10:00-10:20

第二代高带宽内

存物理层(PHY)

与控制器

(Controller)

High Bandwidth

Memory (HBM)

PHY and

Controller

创意电子股份有

限公司CEO,曾

文正

Vincent Tseng,

Director,

GLOBAL

UNICHIP

CORP.

Co., Ltd.

10:20-10:40

智原ASIC/IP

台方案 - 助力半

导体产业百家争

鸣新机遇

Faraday’s ASIC/

IP Platform

Enables the

Innovation of

Next Big Wave

智原科技(上海)

有限公司技术总

监,陈宏铭博

Dr. Arthur Hung-

Ming Chen,

Technical &

Marketing

Director in

Faraday Tech.

(Shanghai)

Corporation

10:40-11:00

Andes CPU

IP提升系统芯片

效能

Boosting SoC

Performance

Efficiency with

Andes CPU IP

晶心科技AVP,

陈志贤

Vincent Chen,

AVP, Andes

Technology

11:00-11:20

IP技术在国内十

年来的演进和发

The Evolution

and

Development

of IP

Technology

in a Decade

in China

四川和芯微电子

股份有限公司董

事长兼CEO,邹

铮贤

Jackie Zou,

Chairman of the

Board & CEO,

IPGoal

Microelectronics

(Sichuan)

Co., Ltd.

11:20-11:40

科技新时代的芯

片设计服务

Design Service:

Your Trusted

Turnkey Partner

in Revolution

Age

灿芯半导体(上

海)有限公司首

席技术官,庄志

John Zhuang,

CTO, Brite

Semiconductor

(Shanghai)

Corporation

11:40-12:00

如何设计自驾车

所需高效能SoC

芯片

Building a High

Performance

SoC for

Autonomous

Car

Arteris, Inc.资深

方案架构师,黄

继樟

Brian Huang,

Senior Solution

Architect,

Arteris, Inc.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet  Lunch

EDAIC设计

EDA and IC Design

13:30-13:50

Cadence

Tensilica为人工

智能提供算力支

Cadence

Tensilica

Provide

Computing

Power for AI

Cadence公司商

务拓展资深经理

徐勇

Jeffrey Xu,

Senior Business

Development

Manager,

Cadence China

13:50-14:10

从设计到芯片核

签流程中最前沿

的技术

Leading Edge

Technologies

Are Required

For Golden

Sign-Off

明导电子中国区

资深技术经理,

牛风举

Actel Niu,

Account

Technology

Manager,

Mentor,

A Siemens

Business

14:10-14:30

Synopsys驱动下

一代芯片设计创

Enabling the

Next Wave of

Design

Innovation

Synopsys中国区

技术应用总监,

Kenny  Kwan

Kenny Kwan,

Director,

Application

Consulting of

China,

Synopsys

14:30-14:50

时序Sign-off

革命

The Revolution

of Timing

Sign-off

北京华大九天软

件有限公司产品

总监,董森华

Senhua Dong,

Supervisor of

Product, Huada

Empyrean

Software

Co., Ltd.

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

集成电路硬件安

全:保证信息系

统安全可靠的物

理基础

Hardware

Security: The

Physical

Protection of

Modern IT

System

中国科学院EDA

中心主任,陈岚

博士

Dr. Lan Chen,

Director, EDA

Center of

Chinese

Academy of

Sciences

15:30-15:50

新一代功耗、噪声、可靠性分析平台 – RedHawk-SC

Next Generation

SoC Power Noise

Reliability Sign

off by

RedHawk-SC

ANSYS公司主任工程师,赵常

Chang Zhao,

Lead

Application

Engineer,

ANSYS

15:50-16:10

倍增你的仿真容量

Double Your

Simulation

Capacity

北京天云融创软件技术有限公司副总裁,郭宏

Hong Guo, VP,

Skycloud

Software

Co., Ltd.

16:10-16:30

先进工艺节点的寄生RC分析和缩减

Analaysis and

Reduction of

Parasitic RCs

For Advanced

Nodes

芯师(上海)电子科技有限公司AE Manager刘客

Ke Liu, AE

Manager,

Silvaco

China.,  Ltd.

16:30-16:50

下一代ECO平台带来性能、功耗与面积的优化,以及可靠性的提高

The Next

Generation ECO

Platform for

Optimizing

Performance,

Power, Area and

Improving

Reliability

知亿科技技术咨询总监,林仕洲

Joe  Lin,

Technical

Consulting

Director, Dorado

Design

Automation, Inc.

16:50-17:10

台积电12FFC设计平台与生态系统

TSMC N12FFC

Design Platform

and Ecosystem

台积电中国业务发展技术经理,卓铭

Ming Zhuo,

Technical

Manager,

Business

Development,

TSMC

17:10-17:30

ECO手术逆向工程导引可能零补丁的第三代ECO技术

Easy DSP-ECO:

A 3rd gen ECO

Evolved from

Adding Patches

to Reverse

Engineering

Guided “ECO

Operations” that

might need No

Patch

香港奇捷科技股份有限公司CEO吴有亮

Yu-Liang Wu,

CEO,

Hong Kong

Easy-Logic

Technology

Ltd.

17:30-17:35

幸运抽奖Lucky  Draw

18:00-20:00 闭幕晚宴及交旗仪式

Closing Banquet and Flag

Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana

Resort Beijing



20171117日,星期五

Nov 17, Friday,2017

专题论坛(二)

Subject Forum(Ⅱ)


地点:北京稻香湖景酒店牡丹1

Venue: Peony Ballroom 1, NirvanaResort Beijing

  

Time

    

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Manufacturing Process Technology

09:00-09:20

台积电的领先技

:7奈米/12奈米/22奈米

TSMC Technology

Leadership: N7/

N12/N22

台积电中国业务发展技术经理,何瑞灵

Ray He,

Technical

Manager,

Business

Development,

TSMC

09:20-09:40

格芯智能制造/工业4.0

GlobalFoundries

Smart

Manufacturing/

Industry 4.0

格芯全球副总裁兼大中华区总经理,白农

Wallace Pai, 

Vice President

and General

Manager of

Greater China,

GLOBALFOUN-DRIES

09:40-10:00

迎接即将爆发的新产品应用浪潮 - 晶圆专工在特殊工艺的技术创新

Foundry

Innovation on

Specialty

Technology for

Emerging

Applications

联华电子协理,丁文琪 

Wenchi Ting,

Associate Vice

President, UMC

10:00-10:20

垂直生态系统及跨行业合作

Vertical Channel

Eco-System &

Cross-Industry

Cooperation

中芯国际集成电路制造有限公司垂直市场生态策略总监,吴耿源

KY Wu, Director of Vertical

Channel

Marketing,SMIC

10:20-10:40

华力微电子28纳米低功耗工艺技术

HLMC 28LP

PolySiON

Technology

上海华力微电子有限公司研发二部总监,彭树根

Albert Pang,

Senior Director

of TD, Shanghai

Huali

Microelectronics

Co., Ltd.

10:40-11:00

摩尔精英让中国没有难做的芯片

MooreElite - To

MakeIC Design

Business Easy

& Fun



摩尔精英COO,董伟

Wei Leo Dong,

COO,

MooreElite

Group

11:00-11:20

深耕模拟与功率半导体制造,助力集成电路成长

CSMC,

Specialized in

Analog and Power

Management

Foundry and

Boosted

Customer's

Growth

华润上华科技有限公司市场销售副总,邵军

Jun Shao, VP of Marketing and

Sales, CSMC

11:20-11:40

三重富士通车规级芯片制造开发与质量管理

Mie Fujitsu

Semiconductor

Automotive IC

Manufacturing

and Quality

Management

三重富士通半导体股份有限公司市场部部长,罗良辅

Liangfu Lo,

Director (Aisa &

Korea) of

Marketing

Dept.,

MIE Fujitsu

Semiconductor

Limited

11:40-12:00

智能时代,畅想

机遇

Opportunities in

the Smart Era

上海华虹宏力半导体制造有限公司战略、市场与发展部门部长,胡湘俊

Calvin Hu,

Director of

Strategy,

Marketing and

Development

Division,

Shanghai

Huahong Grace

Semiconductor

Manufacturing

Corporation

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

13:30-13:50

特种工艺链接世界

A World

Connected by

Specialty

Technologies

TowerJazz中国区总经理,秦磊

Lei Qin, Senior

Sales Director

China Country

Manager,

TowerJazz

13:50-14:10

流片服务对于芯片研发和产品成功的重要性

Professional

Tapeout Service

Plays a Key Role

in R&D and

Market Success

MOSIS专业流片服务机构业务拓展经理,袁泉

Quan Yuan,

Business

Development

Manager, The

MOSIS Service

14:10-14:30

AMS尖端模拟工艺平台,助力客户进入高毛利市场

AMS High

Performance

Analog Process

Support Customer

Enter High Profit

Market

上海劢仕电子有限公司市场部经理,周之琦

Zhiqi Zhou,

Marketing

Manager,

Shanghai MEDs

Technology

Co., Ltd.

14:30-14:50

武汉新芯特种工艺平台

XMC Specialty

Process Platform

武汉新芯集成电路制造有限公司芯片代工事业部总监,沈亮

Neo Shen,

Director of

Foundry

Service

Business Unit,

XMC

14:50-15:10

茶歇,交流Coffee Break

资本与IC设计业

Capital  and IC Design Industry

15:10-15:30

新时代下,中国IC行业发展展望

China IC Industry

Development

Prospects in

New Era

华芯投资管理有限责任公司副总裁,高松涛

Songtao Gao,

Vice President,

SINO IC

CAPITAL Co.,

Ltd.

15:30-15:50

从投资的角度看中国IC设计业的现状与发展

China IC Design

Industry Situation

and Development

from the Point of

Investment

中芯聚源股权投资管理有限公司总裁,孙玉望

Yuwang Sun,

President,

China

Fortune-Tech

Capital Co., Ltd. 

15:50-16:10

风口浪尖上的中国半导体

China IC in Big

Waves

华登国际董事总经理,黄庆博士

Dr. Hing Wong,

Managing

Director(MD),

Walden

International

自由研讨 — IPO、企业并购和商业经营,

产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation, 

Integral Industry Development Way

16:10-17:30

研讨嘉宾:魏少军、陈大同、黄庆、高松涛、孙玉望等

在举国半导体投资发展热潮中,中国集成电路设计行业也有了长足的发展,继紫光集团成功收购展讯锐迪科之后;清芯华创牵头收购豪威科技,武岳峰牵头收购ISSI,兆易创新成功IPO成为全体中国IC设计公司瞩目的最新焦点!

那么,下一个兆易创新会在哪里?近距离面对中国这个最让人魂系神往的资本市场,我们中国集成电路设计企业应该如何才能淡定应对?全球集成电路行业会在那个层面展开新一轮的创新竞争?

 

Honored GuestsProf. Wei

Shaojun, Dr. Chen Datong, Dr.

Hing Wong, Mr. Gao Songtao,

etc.

 

Under the Tide of National

Semiconductor Investment and

Development, China IC Design

Industry has been Developing

Rapidly. After UnisGroup

successfully Acquired

Spreadtrum and RDA, Hua

Capital led to Acquire

OmniVision, Summit View

Capital led to Acquire ISSI,

China IC Design Industry is all

Focusing on Giga Device

successful IPO

 

Then, Where is Next Giga Device?

When closely Facingthis China

Charming Capital Market, How

shall We China IC Design Industry

Respond Calmly? What’s Next

Innovation Competition for Global

IC Industry?

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag

Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana

Resort Beijing



20171117日,星期五

Nov 17, Friday,2017

专题论坛(三)

Subject Forum(Ⅲ)

 

地点:北京稻香湖景酒店牡丹2

Venue: Peony Ballroom 2, NirvanaResort Beijing

  

Time

    

Contents

演讲人

Lecturer

IPIC设计(II

IP and  IC Design (II)

09:00-09:20

钢铁是怎样炼成的

The Road to

KX-5000 Series

上海兆芯集成电路有限公司副总裁,傅城

ChengFu, VP,

Shanghai

Zhaoxin

Semiconductor

Co., Ltd.

09:20-09:40

台积电7nm先进工艺下的设计方法

TSMC N7 Digital Design 

Enablement

台积电南京设计服务中心部门经理,曹宗良

Z.L. CAO,

Department

Manager,

Nanjing Design

Service Center,

TSMC

09:40-10:00

高效的处理架构让AI无处不在

An Efficient

Processor

Architecture

Enable AI

Everywhere

芯原控股有限公司执行副总裁、

IP事业部总经理、首席战略官,戴伟进

Weijin Dai,

Executive Vice

President, GM

of IP Division

and Chief

Strategy Officer,

VeriSilicon

Holdings Co.,

Ltd.

10:00-10:20

面向物联网设备的平台安全架构

Platform Security  Architecture for

IoT Device

Arm高级技术市场经理,王骏超

Eric Wang,

Senior

Technical

Marketing

Manager,

Arm China

10:20-10:40

高度定制化IP解决方案的现状和展望

The Trend and

Prospect of

Highly Customized

IP Solution

芯动科技有限公司FAE总监,何颖

Huck He, FAE

Director,

Innosilicon

Technology Ltd.

10:40-11:00

汽车MCU软件、硬件平台型开发技术

Discussion of Auto

MCU Softwareand

Hardware Platform

Development

Technology

恩智浦半导体汽车控制器和处理器事业部亚太市场总监,易生海

Jerwern Yi,

Marketing

Director,

Asia Auto

MCU and

MPU, NXP

11:00-11:20

人工智能时代的2.5D/3D先进封装设计

2.5D/3D Advanced

Packaging Design

for Artificial

Intelligence Era

苏州芯禾电子科技有限公司创始人/工程副总裁,代文亮

Dai Wenliang,

Founder VP

Engineering,

Xpeedic

Technology

11:20-11:40

浅谈人工智能时代的高性能计算芯片

Brief Discussion of

High Performance

Computing Chip

in AI Era

无锡华大国奇科技有限公司

CEO,谷建餘

Jianyu Gu,

CEO, Qualchip

Technologies,

Inc.

11:40-12:00

现今趋势中在线存储器测试与修复之应用

The Trend of

Memory on

Demand Test and

Repair of

Applications

厚翼科技中国区销售总监,王炳兴

Benson Wang, VP of China

Region, HOYTechnologies Corp.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

13:30-13:50

The Challenge of Systemic

Complexity: The

Need for An

Architecture for

Debug, Safety &

Security

Rupert Baines, CEO, UltraSoC

13:50-14:10

M31低功耗套装平台

M31 Low Power

Platform

円星科技股份有限公司业务副总监,林世腾

Johnson Lin,

Deputy Sales

Director, M31

Technology

14:10-14:30

针对NB-IoT终端设备的单处理器核完整IP方案

Complete Single

Processor IP

Solution for NB-

IoT Enabled

Endpoint Devices

CEVA中国FAE经理,杨晔

Luke Yang,

China FAE

Manager, CEVA

14:30-14:50

领导变革-芯片行业如何部署技术创新和外包战略

Leading the

Disruptions

- How does

Industrials &

Electronics

Industry Deploy

Technology

Innovation and

Outsourcing

Strategy

亚创中国半导体事业部总监,石贤帅

Xianshuai

(Stone) Shi,

I&E Division

Director, 

Altran China

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

Chips&Media面向监控/车载应用,针对低照度环境优化的ISPIP
Chips&Media’s

Low Light

Environment

Optimized Image

Signal Processing

IP for Surveillance

and Automotive

Applications

Chips&Media中国区销售经理,陶南

Larry Tao,

Country

Manager

China Sales,

Chips&Media

15:30-15:50

Imagination AI解决方案激发智能社会充满想象

Imagination AI

Stimulate the

Innovation of

Human Society

Imagination中国区市场总监,柯川

Bowen Ke,

Marketing

Director,

Imagination

Technologies

15:50-16:10

系统层级设计方法架构探索与高阶合成设计

Electronic System

- Level Design

Methodology:

Architecture

Exploration & High

Level Synthesis

宏太科技股份有限公司应用经理,王义成

Frank Wang, AE

Manager, Avant

Technology Inc.

16:10-16:30

针对自动驾驶SoC的智能互联

Intelligent

Interconnect for

Automotive SoCs

Alex Chao,

Sr. Director of

Worldwide Field

Applications,

NetSpeed

Systems

16:30-16:50

物联网应用之安全强化特殊型

NeoFuse IP解决方案

Specialty NeoFuse

IP Simplify

Security

Enhancement for

IoT Application

力旺电子营销副处长,郭东政

Steve Kuo,

Marketing

Deputy

Director,

eMemory

16:50-17:10

多用途的嵌入式

SuperFlash技术

在物联网和汽车电

子上的应用

Versatile 

Embedded

SuperFlash®

Technology for

IoT and

Automotive

Applications

Vipin Tiwari,

Director,

Marketing and

Business

Development,

Silicon Storage

Technology, Inc.

17:10-17:30

物联网时代的

DRAM:高速,串

接简易

DRAM for IoT

Applications with

Low-Pin Count,

High Speed, Serial

Interface

爱普科技股份有限公司总经理,顾峻

Jun Gu, GM, AP Memory

Technology

CO., LTD.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag

Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana

Resort Beijing



20171117日,星期五

Nov 17, Friday,2017

专题论坛(四)

Subject Forum(Ⅳ)

 

地点:北京稻香湖景酒店牡丹3

Venue: Peony Ballroom 3, NirvanaResort Beijing

  

Time

    

Contents

演讲人

Lecturer

封装测试与IC设计

IC Design and Packaging &  Testing

09:00-09:20

高速成长IC新应用的先进封装技术

Advance

Packaging

Technologies for

the Fast Growing

IC Applications

 

江苏长电科技股份有限公司高级副总裁,梁新夫

Steve Xin Liang,

SVP, JCET

09:20-09:40

通富微电在

Processing Unit

封测解决方案

TFME Full

Backend Solution

at Processing Unit

通富微电子技术中心副总,林伟

Wayne Lin, Vice

President, R&D

Center, TFME

09:40-10:00

芯片产品的全程可溯

IC Product

Traceability

Across Supply

Chain

PDF中国总经理、全球副总裁,房华博士

Dr. Hua Fang,

PDF-China GM,

Global VP

10:00-10:20

智能芯片商机与可靠性之挑战

Business

Opportunity and

Challenge for AI

Semiconductors

宜特检测技术有限公司董事长,崔革文

Kevin Tsui, iST

China Chairman

& General

Manager

10:20-10:40

车用电子新一波的封装技术趋势与解决方案

New Wave

Technology Trend

& Packaging

Solution for

Automotive

Application

日月光集团制造工程处处长,沈政昌

Allen Shen,

Engineering

Director,

ASE Group

10:40-11:00

系统级封装(SiP)的市场和技术发展趋势

SiP (System in

Package) Market

and Technology

Trend

安靠封装测试资深总监,李吕祝

John Lee, Sr.

Director, Amkor

Technology

11:00-11:20

高性能计算应用之创新封装解决方案

The Innovate

Packaging

Solutions In High

Performance

Computing

矽品精密工业股份有限公司研发中心客户前瞻产品处副处长,陈盟顺

Royal Chen,

Deputy Director,

Customer

Advanced

Package

Application

Engineering of

CRD, SPIL

11:20-11:40

IC设计与Probe

Card结合的重要性

IC Design and

Probe Card

Integration

Solutions

深圳市道格特科技有限公司副总经理,李忠民

Tommy Lee, VP,

Shenzhen

Doctor

Technology

Co., Ltd.

11:40-12:00

物联网技术的测试挑战以及是德科技的解决方案

IoT Technology

Test Challenges

and Keysight

Solutions

是德科技中华区市场部行业市场经理,祝晓悦

Xiaoyue Zhu,

Marketing

Industry

Manager,

Keysight 

Technologies

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

13:30-13:50

持续驱动集成电路小型化和性能提升的晶圆级封装技术

Wafer-level

Packaging

Technologies as

A Key Enabler for

Continuous

Miniaturization

and Performance

Enhancement of

Integrated Circuits

华天科技(昆山)电子有限公司技术总监,王腾

Teng Wang,

Technical

Director,

Huatian

Technology

(Kunshan)

Electronics

Co., Ltd.

13:50-14:10

测试的发展趋势:过去,现状及预测未来

TestTrends: Past,

Present and

Predicting the

Future

泰瑞达半导体测试部SoC商务组和市场销售副总裁兼总经理,徐建仁

Jason Zee,

VP and GM,

SoC Business

Group and

Marketing,

Teradyne

14:10-14:30

R&S 最新IoT测试技术和解决方案

R&S Latest IoT

Test Techniques

and Solutions

罗德与施瓦茨(中国)科技有限公司业务发展主管,杨洪文

Hongwen Yang,Business

Development

Manager,

Rohde &

Schwarz

(China)

Technology

Co., Ltd.

14:30-14:50

利用NI平台降低测试成本与加速产品上市时间

Lowering the Cost

of Test while

Improving Time-

To-Market with NI

Platform-based

Approach

美国国家仪器有限公司市场工程师,马力斯

Lisi Ma,

Technical

Marketing

Engineer,

National

Instruments

14:50-15:10

茶歇,交流Coffee Break

15:10-15:30

物联网时代的芯片测试解决方案

Testing Devices

for the IoT and

Smart

Applications

爱德万测试(中国)管理有限公司北京分公司测试技术部课长,张可

Ke Zhang,

Section

Manager, BJT

Department,

Advantest

(China)

Co., Ltd.

Beijing Branch

15:30-15:50

全方位测试解决方案

Comprehensive

Semiconductor

Testing Solution

京元电子股份有限公司资深处长,刘大纲

Takang Liu,

Senior Director,

KYEC Yuan

Electronics

Co., Ltd.

15:50-15:55

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag

Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana

Resort Beijing



20171117日,星期五

Nov 17, Friday, 2017

专题论坛(五)

Subject Forum (V)

 

地点:北京稻香湖景酒店牡丹4

Venue: Peony Ballroom 4, Nirvana Resort Beijing

时  间

Time

内  容

Contents

演讲人

Lecturer

芯”动北京 - 暨首届中关村IC产业发展论坛

Chip-Power Beijing and First Zhongguancun IC

Industry Development Forum

主持人:中关村集成电路设计园领导主持

Moderator: IC PARK Leader

09:00-09:05

海淀区领导致欢迎词

Welcome Speech from the Leader

of Haidian District Government

09:05-09:10

中关村管委会领导讲话

Speech from the Leader of

Administrative Committee of

Zhongguancun  Science Park

09:10-09:15

市科委领导讲话

Speech from the Leader of Beijing

Municipal Committee of Science

and Technology

09:15-09:30

人工智能行业研究及成果转化

Research and

Result

Transformation

of AI Industry

清华微电子所所长,魏少军教授

Prof. Shaojun

Wei, Director,

Institute of

Microelectronics,

Tsinghua

University

09:30-09:45

百度人工智能的基础技术及应用创新

Basic

Technology and

Application

Innovation of

Baidu AI

百度技术体系主任架构师,欧阳剑

Jian Ouyang,

Director,

Technology

System

Architect, Baidu

09:45-10:00

人工智能时代的端到端芯片战略

End-to-end

Chip Strategy

in the AI Era

英特尔中国研究院院长,宋继强

Jiqiang Song,

General

Manager, Intel

Labs China

10:00-10:15

嵌入式人工智能:从算法到处理器

Embedded AI:

From

Algorithms to

Processors

北京地平线机器人技术研发有限公司创始人&CEO余凯

Kai Yu, Founder

& CEO, Beijing

Horizon Robotics

Technology

Research and

Development

Co., Ltd.

10:15-10:30

智能语音技术如何商业化应用

How to

Commercialize

Intelligent Voice

Technologies

北京云知声信息

技术有限公司

CEO,黄伟

Wei Huang,

CEO, Unisound

10:30-10:45

智慧存储加速人工智能创新

Intelligent

Storage for

Artificial

Intelligence

英韧创信息科技

有限公司董事长

CEO,吴子宁

Zining Wu,

Chairman and

CEO, InnoGrit

Co., Ltd.

10:45-11:00

存储的共享与自治——万物智联时代的数据管理

Perception,

Comprehension

and Memory --

New Storage

Requirement in

the AI Era

北京忆芯科技有限公司ASIC设计首席工程师孙唐

Tang Sun, Chief

Architect, ASIC

Design,

Starblaze

Technology

Co., Ltd.

11:00-11:05

幸运抽奖Lucky Draw

12:00-13:30

自助午餐Buffet  Lunch

芯片奥林匹克IEEE国际固态电路峰会

ISSCC中国发布会 - 最新IC设计技术趋势

“Chip  Olympic” - IEEE ISSCC China Press

Conference – Technical Trends of IC Design

主持人:ISSCC国际技术委员会中国区代表,

余成斌教授,IEEE会士

Moderator:  Prof. Seng-Pan (Ben) U, IEEE Fellow,

ISSCC ITPC China Country Representative

13:30-13:50

注册

Registration

13:50-14:00

致欢迎词

-- Jan van der Spiegel 教授和IEEE

士,IEEE ISSCC 2018执行委员会成

员,IEEE SSCS现任主席,美国宾夕

法尼亚大学(清华大学访问教授)

Welcome Remarks

-- Prof. Jan van der Spiegel, IEEE

Fellow, IEEE ISSCC 2018

Executive Committee Member,

IEEE SSCS President, Univ. of

Pennsylvania, USA

14:00-14:10

芯片奥林匹克IEEE国际固态电路峰会

ISSCC 2018简介

-- Sungdae Choi博士,ISSCC国际技术委员会远东区主席,韩国海力士半导体

Introduction of Chip Olympic IEEE

ISSCC 2018

-- Dr. Sungdae Choi, ISSCC 2018

ITPC Far East Chair, SK Hynix,

Korea

14:10-14:20

ISSCC 2018远东区的技术趋势   

-- 李泰成教授,ISSCC国际技术委员会远东区副主席, 台湾大学

Far East Technical Trends for

ISSCC 2018

-- Tai-Cheng Lee, ISSCC ITPC

Far East Vice-Chair, Taiwan

University

14:20-14:35

ISSCC 2018中国区入选论文和发展趋势

-- 余成斌教授和IEEE会士,ISSCC国际技术委员会委员及中国区代表,澳门大学和新诺普思澳门

-- 王志华教授和IEEE会士,SSCS行政委员会委员,清华大学

ISSCC 2018 China Papers and

Trends

-- Prof. Seng-Pan (Ben) U, IEEE

Fellow, ISSCC ITPC China

Country Representative, Univ. of

Macau and Synopsys Macau

-- Prof. Zhihua Wang, IEEE Fellow,

SSCS AdCom, Tsinghua University

14:35-14:50

问答讨论(首轮)和合影

Q&A  (1st round) and Group Photo

14:50-15:10

茶歇,交流Coffee Break

ISSCC 2018峰会设计领域论文亮点和点评

ISSCC 2018国际技术委员会委员

ISSCC 2018 Subcommittee Paper Highlights

ISSCC 2018 International Technical  Program

Committee (ITPC) Member

15:10-15:20

电源管理

Power

Management

复旦大学,洪志良教授

Prof. Zhiliang

Hong, Fudan

University

15:20-15:30

模拟电路 / 射频电路

Analog / RF

澳门大学,罗文基副教授

Prof. Man-Kay

Law, Univ. of

Macau

15:30-15:40

数据转换器

Data Converters

澳门大学和新诺普思澳门,余成斌教授
Prof. Seng-Pan

(Ben) U, Univ. of

Macau and

Synopsys

Macau

15:40-15:50

数字架构和系统 / 数字电路

Digital

Architecture &

System /

Digital Circuits

日本东京大学,

Makoto

Takamiya教授

Prof. Makoto

Takamiya, Univ.

of Tokyo

15:50-16:00

存储器

Memory

韩国海力士半导体,Sungdae

Choi博士

Dr. Sungdae

Choi, SK Hynix

16:00-16:10

图像, MEMS医疗和显示 / 有线通讯
Imagers,

MEMS,

Medical &

Displays

(IMMD) /

Wireline

台湾大学,李泰成教授

Prof. Tai-Cheng

Lee, Taiwan

University

16:10-16:20

无线通讯 / 前瞻技术领域

Wireless /

Technology

Directions

澳门大学,麦沛然教授

Prof. Pui-In Mak,

University of

Macau

16:20-16:40

问答讨论(第二轮)

Q&A  (2nd round)

16:40-16:45

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag

Handover Ceremony

地点:北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana

Resort Beijing



  会议日程以最终现场公布为准。

Agendaup to final site release.